| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2132568-1 |
| Series: | IMPACT |
| Amperage: | .75 A |
| Connector Type: | Header |
| Gender: | Plug |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Contacts: | 54 |
| Number of Rows: | 9 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Copper-Nickel-Silicon |
| Contact Plating: | Gold |
| Maximum Operating Temperature: | 185 °F, 85 °C |
| Body Orientation: | Straight |
| Pitch: | .075 in, 1.9 mm |
| Voltage: | 30 V AC, 30 V DC |
| Contact Type: | Pin |
| Contact Length: | 13.4 mm, .177 in, 4.5 mm |
| Row Spacing: | .053 in, 1.35 mm |
| Impedance: | 100 Ω |
| PCB Hole Diameter: | .015 in, .39 mm |
| Number of Pairs: | 18 |
| Number of Positions: | 54 |
| Data Rate: | 20 - 25 Gb/s |
| Housing Color: | Black |
| Mount Orientation: | Vertical |
| GPL: | K74 |
| Tail Length: | .055 in, 1.4 mm |
| Packaging: | Box & Tube, Tube |
| Operating Temperature Range: | -55 - 85 °C, -67 - 185 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 29.92 µin, .76 µm |
| PCB Retention: | With |
| Contact Underplating Material: | Nickel |
| PCB Thickness (Recommended): | 3 mm |
| Connector Height: | 11.95 mm, .47 in |
| PCB Retention Type: | Action/Compliant Tail |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | L774 |
| Number of Columns: | 6 |
| Number of Signal Positions: | 36 |
| Contact Design: | Dual Beam |
| Contact Layout: | Inline |
| Contact Transmits: | Signal (Data) |
| Connector Length: | .527 in |
| Connector System: | Board to Board |
| UL Agency Certification: | E28476 |
| Contact Termination Plating: | Tin |
| Stackable: | No |
| Connector Product Type: | Connector |
| Pairs Per Column: | 3 |
| Contact Style: | Press-Fit |
| Board to Board Configuration: | Orthogonal, Vertical |
| Contact Underplating Thickness: | 1.27 µm, 50 µin |
| PCB Contact Termination Area Plating Finish: | Matte |
| Connector Width: | 16.7 mm, .657 in |
| Mating Retention: | Without |
| Make First / Break Last: | No |
| Shroud Type: | Partial |
| PCB Contact Termination Area Plating Thickness: | 30 - 60 µin, .76 - 1.52 µm |
| Guide Location: | Unguided |
| Number of Ground Positions: | 18 |
| End Wall Location: | Right |
| Guide Hardware: | Without |
| Signal Arrangement: | Differential |
| Standards Met: | Yes UL 94V-0 |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 2132568-1 |
| SKU: | AMP2132568-1 |
2132568-1
Specifications
Detailed Description
Enhance your signal transmission with the IMP100O board-to-board connector. Featuring 54 contacts in a straight, 9-row configuration, this connector provides reliable connectivity for high-speed data applications. With a pitch of 1.9mm and impedance of 100Ω, it ensures optimal signal integrity. The contact design, dual beam with gold plating, guarantees low insertion loss and high durability. Operating at temperatures ranging from -55 to 85°C, it meets stringent performance requirements. Perfect for signal transmission in electronic devices, this connector is RoHS compliant, ensuring environmental responsibility. Elevate your connectivity with the IMP100O.

