2132702-1

AMP2132702-1
Heilind Number:AMP2132702-1
Manufacturer:TE Connectivity
Manufacturer Number:2132702-1
Datasheet:Drawing
ECAD Model:
3D Model

Description:

IMP100O,R,RA5P10C,LG,46

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Specifications

AttributeValue
Product Category:
Backplane Connectors & Accessories Backplane Connectors
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2132702-1
Series:IMPACT
Amperage:.75 A
Connector Type:Connector Assembly
Gender:Receptacle
Housing Material:LCP (Liquid Crystal Polymer)
Number of Rows:15
Mount Type:Board Mount
Termination Method:Through Hole - Press-Fit
Contact Material:Copper Alloy
Pitch:.075 in, 1.9 mm
Voltage:30 V AC, 30 V DC
Contact Type:Socket
Contact Length:28.35 mm
Row Spacing:.053 in, 1.35 mm
Impedance:100 Ω
PCB Hole Diameter:.018 in, .46 mm
Number of Pairs:50
Number of Positions:150
Data Rate:20 - 25 Gb/s
Housing Color:Black
Mount Orientation:Right Angle
GPL:K74
Tail Length:.047 in, 1.2 mm
Packaging:Box & Tube, Tube
Operating Temperature Range:-55 - 85 °C, -67 - 185 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:29.92 - 59.84 µin, .76 µm
PCB Retention:With
Contact Underplating Material:Nickel
PCB Thickness (Recommended):1 mm
Connector Height:21.4 mm, .843 in
PCB Retention Type:Action/Compliant Tail & Screw
Sealable:No
Mating Alignment:With
Mating Alignment Type:Guide Pin
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:L779
Number of Columns:10
Number of Signal Positions:100
Contact Design:Dual Beam
Contact Layout:Inline
Contact Transmits:Signal (Data)
Connector Length:1.16 in
Connector System:Board to Board
UL Agency Certification:E28476
Contact Termination Plating:Tin
Stackable:No
Connector Product Type:Connector
Pairs Per Column:5
Contact Style:Press-Fit
Board to Board Configuration:Orthogonal, Right Angle
Contact Underplating Thickness:1.27 µm, 50 µin
PCB Contact Termination Area Plating Finish:Matte
Connector Width:1.268 in, 32.2 mm
Mating Retention:Without
PCB Mount Alignment Type:Locating Posts
Make First / Break Last:No
Shroud Type:No
PCB Contact Termination Area Plating Thickness:30 - 60 µin, .76 - 1.52 µm
Guide Location:Left
Number of Ground Positions:50
Guide Hardware:With
Signal Arrangement:Differential
Material Flammability Standard:UL 94V-0
Part Aliases:2132702-1
SKU:AMP2132702-1

Detailed Description

Enhance your signal transmission capabilities with the IMP100O board-to-board connector from our IMPACT series. This high-performance connector features a contact design of dual beam inline layout, ensuring reliable data transmission. With a contact arrangement of 100 signal positions in a right angle orthogonal configuration, it offers seamless connectivity for your circuit applications. The housing, made of UL 94V-0 rated LCP in sleek black, provides durability and protection. Operating within a wide temperature range of -55 to 85°C (-67 to 185°F), it's suitable for various environments. Each contact, plated with gold for excellent conductivity, is terminated through press-fit technology, guaranteeing secure attachment to the PCB. With 50 pairs per column and 10 columns, totaling 150 positions, this connector accommodates a substantial data transfer capacity of 20-25 Gb/s. RoHS compliant and UL agency certified, it meets stringent quality standards for your peace of mind. Whether in data centers or telecommunications systems, the IMP100O connector is the perfect choice for high-speed and high-density applications. Elevate your connectivity solutions with this advanced board-to-board connector.