2157481-2

AMP2157481-2
Heilind Number:AMP2157481-2
Manufacturer:TE Connectivity
Manufacturer Number:2157481-2
Datasheet:Drawing
ECAD Model:
3D Model

Description:

AMPLIMITE IP67, SZ2, 109, 15 POS, RCPT

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Specifications

AttributeValue
Product Category:
D-Sub & D-Ribbon Connectors & Accessories D-Sub Connectors
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2157481-2
Gender:Crimp Snap
Housing Material:Thermoplastic
Mount Type:Panel
Termination Method:Crimp
Pitch:.109 in, 2.77 mm
Shell Size:2
Contact Size:20
Shell Plating:Zinc
Insert Material:Thermoplastic
Contact Amperage:7.5 A
Number of Positions:15
Housing Color:Black
GPL:243
Shield Material:Steel
Shell Material:Carbon Steel
Operating Temperature Range:-55 - 125 °C, -67 - 257 °F
Circuit Application:Signal
Shielded:No
Sealable:Yes
GPL Description:Aerospace Defense & Marine
Connector and Contact Terminate To:Wire & Cable
Product Code:X536
Connector System:Cable-to-Cable
Connector Product Type:Connector
ECCN:EAR99
Mating Connector Lock:Without
Retainer Clip Material:Stainless Steel
Grommets:With
Grounding Indents:Without
Shell Type:Metal
Insert Flammability Standard:V-0
Part Aliases:2157481-2
SKU:AMP2157481-2

Detailed Description

Experience reliable connectivity with our AMPLIMITE IP67 D-Sub Connector. Designed for demanding environments, this connector features a rugged construction with a thermoplastic housing and zinc shell plating, ensuring durability. With a 15-position layout and 20-contact size, it's suitable for various signal applications. Its panel mount design and crimp snap termination method offer easy installation. Operating in a wide temperature range from -55 to 125°C, it's ideal for aerospace, defense, and marine industries. This connector is wave solder capable and complies with RoHS standards, making it a sustainable choice for your projects. Whether you need it for cable-to-cable connections or other applications, its high-performance capabilities make it a versatile solution. Trust in the AMPLIMITE IP67 D-Sub Connector for seamless connectivity in challenging conditions.