Enhance the stability and performance of your XFP modules with this comprehensive kit, featuring a cage, clip, and heat sink for optimal cooling and secure mounting. Designed for through-hole press-fit termination and double-sided (belly-to-belly) PCB mounting, this assembly ensures reliable connectivity in high-speed applications. Packaged in a tray for convenient handling, it is compliant with RoHS standards for environmentally conscious sourcing. Upgrade your IO connectors with this essential component for seamless data transmission.