| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2170488-6 |
| Series: | XFP |
| Packaging: | Box & Tray |
| Product: | XFP |
| SKU: | AMP2170488-6 |
2170488-6
| Heilind Number: | AMP2170488-6 |
| Manufacturer: | TE Connectivity |
| Manufacturer Number: | 2170488-6 |
| ECAD Model: | |
Specifications
Detailed Description
Enhance the performance of your XFP module with our innovative HEAT SINK. Specifically designed for efficient heat dissipation, this essential component ensures optimal functioning and longevity of your device. Crafted with high-quality materials, it offers reliable cooling capabilities for seamless operation, even under intense usage. RoHS-compliant and meticulously tested, it guarantees both performance and environmental responsibility. Elevate your connectivity experience with our XFP HEAT SINK.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 01/30/2026 | PCN-25-249613 - Manufacturing location change. TE's on-going supply chain risk management strategy, the listed products are to be migrated to production sites from Zhuhai China plant to Dongguan China plant. | Download | |||
