| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2170753-4 |
| Series: | zQSFP+/QSFP28 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Number of Ports: | 1 |
| Data Interface: | QSFP28/56 |
| Data Rate: | 28 Gb/s |
| Application: | Standard |
| GPL: | J25 |
| Port Matrix Configuration: | 1 x 1 |
| Tail Length: | .081 in, 2.05 mm |
| Packaging: | Box & Tray |
| Operating Temperature Range: | -40 - 185 °F, -40 - 85 °C |
| Circuit Application: | Signal |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | .062 in, 1.57 mm |
| Sealable: | Yes |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | X260 |
| EMI and RFI Protection Type: | Elastomeric Gasket |
| Connector System: | Cable-to-Board |
| Connector Product Type: | Cage Assembly |
| ECCN: | EAR99 |
| Heat Sink Style: | Pin |
| Cage Type: | Ganged |
| Heat Sink Finish: | Anodized Black |
| Heat Sink Height Class: | PCI |
| Heat Sink Height: | .165 in, 4.2 mm |
| Cage Material: | Nickel Silver |
| Heat Sink Compatible: | Yes |
| Lightpipe Included: | No |
| Enhancements: | Standard |
| Included Accessory: | Heat Sink |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 2170753-4 |
| SKU: | AMP2170753-4 |
2170753-4
Specifications
Detailed Description
Enhance your standard data and device connectivity with this high-speed Cage Assembly, perfect for QSFP28/56 applications. Featuring a ganged, board-mount design with through-hole press-fit termination, this assembly ensures secure and reliable signal transmission at 28 Gb/s. Compliant with UL 94V-0 flammability standards, it guarantees safety and performance in various environments, with an operating temperature range of -40 to 85°C (-40 to 185°F). The included elastomeric gasket provides EMI and RFI protection, while the anodized black nickel silver construction offers durability and heat dissipation. Tailored for efficient PCB integration, this assembly is a versatile solution for high-speed data connectivity needs.

