2213616-3

Heilind Number:AMP2213616-3
Manufacturer:TE Connectivity
Manufacturer Number:2213616-3
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

HERM BLADE & RECPT,6 POS,POST,SEL GOLD

More >>

Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2213616-3
Housing Material:Liquid Crystal Polymer
Termination Method:Surface Mount
Pitch:4 mm
Contact Type:Hermaphroditic
Contact Amperage:6 A
Number of Positions:6
Housing Color:Natural
Mount Orientation:Horizontal
GPL:K50
Packaging:Pocket tape on reel
Circuit Application:Power
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:1.52 - 3.04 µm
PCB Retention:Without
Contact Underplating Material:Nickel
Sealable:No
Mating Alignment:Without
GPL Description:Industrial
Product Code:L833
Connector System:Board to Board
ECCN:EAR99
Board to Board Configuration:Co-Planar
Contact Mating Area Plating Finish:Matte
PCB Mount Alignment:With
PCB Mount Alignment Type:Peg
Connector Assembly Type:PCB Mount Hermaphroditic Connector
Material Flammability Standard:UL 94V-0
Part Aliases:2213616-3
SKU:AMP2213616-3

Detailed Description

Explore high-performance connectivity with this Board to Board PCB Mount Hermaphroditic Connector, designed for power circuit applications. Featuring a liquid crystal polymer housing in a natural color, this connector ensures durability and reliability. With a 6-position, 4mm pitch layout, it offers efficient signal transmission. The surface mount termination method and gold contact plating guarantee secure and low-resistance connections, meeting UL 94V-0 flammability standards. Ideal for industrial use, it comes in pocket tape on reel packaging for convenient handling. Its co-planar board-to-board configuration and horizontal mount orientation, with peg alignment, facilitate seamless assembly. RoHS compliant and ECCN EAR99, this connector assures compliance with international standards. Elevate your electronic designs with the L833 model, delivering quality performance in a compact form factor.