2214565-1

Heilind Number:AMP2214565-1
Manufacturer:TE Connectivity
Manufacturer Number:2214565-1
Datasheet:Drawing
ECAD Model:
3D Model

Description:

zQSFP+ STACKED RECEPTACLE ASSEMBLY 2X3

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2214565-1
Series:zQSFP+/QSFP28
Mount Type:Board Mount
Termination Method:Through Hole - Press-Fit
Pitch:.032 in, 8 mm
Number of Ports:6
Data Interface:zQSFP+
Contact Amperage:.5 A
Number of Positions:190
Data Rate:28 Gb/s
Application:Standard
GPL:J25
Port Matrix Configuration:2 x 3
Tail Length:.079 in, 2 mm
Packaging:Box & Tray
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin, .76 µm
Contact Underplating Material:Tin
PCB Contact Termination Area Plating:Gold
PCB Thickness (Recommended):.062 in, 1.57 mm
Sealable:Yes
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:L818
EMI and RFI Protection Type:Elastomeric Gasket
Connector System:Cable-to-Board
Connector Product Type:Cage Assembly with Integrated Connector
ECCN:EAR99
Cage Type:Stacked
Rear EONs Per Port Column:3
Cage Material:Nickel Silver
Heat Sink Compatible:No
Lightpipe Included:No
Enhancements:Standard
Material Flammability Standard:UL 94V-0
Part Aliases:2214565-1
SKU:AMP2214565-1

Detailed Description

Enhance your high-speed data transmission capabilities with the zQSFP+ STACKED RECEPTACLE ASSEMBLY. This advanced 2x3 assembly is designed for seamless board mount installation, featuring a termination method of Through Hole - Press-Fit for secure connectivity. With a pitch of .8mm and supporting a data rate of 28 Gb/s, it offers exceptional performance in demanding applications. Meeting UL 94V-0 flammability standards, it ensures safety and reliability. The cage assembly with integrated connector design includes six ports for versatile connectivity options. Its gold-plated contact mating area and tin underplating guarantee optimal signal transmission. Operating in a wide temperature range from -55 to 105°C, this assembly is suitable for various environments. RoHS compliant and lead-free solder capable, it aligns with environmental and industry standards. Perfect for use in data centers, telecom infrastructure, and other high-speed communication systems. Elevate your connectivity solutions with this essential component.