2227668-2

Heilind Number:AMP2227668-2
Manufacturer:TE Connectivity
Manufacturer Number:2227668-2
Datasheet:Drawing
ECAD Model:
3D Model

Description:

zQSFP+ STACKED RECEPTACLE ASSEMBLY 2X3

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2227668-2
Series:zQSFP+/QSFP28
Mount Type:Board Mount
Termination Method:Through Hole - Press-Fit
Pitch:.032 in, 8 mm
Number of Ports:6
Data Interface:zQSFP+
Contact Amperage:.5 A
Number of Positions:228
Data Rate:28 Gb/s
Application:Standard
GPL:J25
Port Matrix Configuration:2 x 3
Tail Length:.079 in, 2 mm
Packaging:Box & Tray
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin, .76 µm
Contact Underplating Material:Tin
PCB Contact Termination Area Plating:Gold
PCB Thickness (Recommended):.062 in, 1.57 mm
Sealable:No
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:L818
EMI and RFI Protection Type:Internal/External EMI Springs
Connector System:Cable-to-Board
Connector Product Type:Cage Assembly with Integrated Connector
ECCN:EAR99
Cage Type:Stacked
Lightpipe Configuraton:Outer Left Indicator Up
Cage Material:Nickel Silver
Heat Sink Compatible:No
Lightpipe Included:Yes
Enhancements:Standard
Material Flammability Standard:UL 94V-0
Part Aliases:2227668-2
SKU:AMP2227668-2

Detailed Description

Experience high-speed connectivity with the zQSFP+ STACKED RECEPTACLE ASSEMBLY 2X3. This board mount assembly features six ports for seamless data transmission, meeting standard application requirements with a data rate of 28 Gb/s. With UL 94V-0 flammability standard compliance, it ensures safety and reliability. The gold-plated contact mating area guarantees optimal signal transfer, while the through-hole press-fit termination method offers secure attachment to the PCB. Operating in a wide temperature range from -55 to 105 °C, this assembly is suitable for various environments. Its compact 2x3 port matrix configuration and stackable design make it ideal for space-constrained applications. RoHS compliant and lead-free solder process capable, it aligns with environmental and industry standards. Upgrade your high-speed connectivity solutions with this versatile and efficient assembly.