| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2246041-1 |
| Series: | microSFP+ |
| Termination Method: | Through Hole - Solder |
| Pitch: | .034 in, .875 mm |
| Number of Ports: | 1 |
| Number of Positions: | 22 |
| Data Rate: | 10 Gb/s |
| Port Matrix Configuration: | 1 x 1 |
| Operating Temperature Range: | -55 - 105 °C, -67 - 221 °F |
| PCB Mounting Style: | Through Hole - Solder |
| Product: | SFP/SFP+/zSFP+ |
| Product Type: | Cage Assembly with Integrated Connector |
| SKU: | AMP2246041-1 |
2246041-1
Specifications
Detailed Description
Enhance connectivity with our MICRO SFP+ assembly, designed for high-speed performance. This Through Hole - Solder termination method ensures secure attachment, while the compact pitch of .034 in (.875 mm) optimizes space efficiency. With 22 positions and a data rate of 10 Gb/s, it offers seamless transmission in a 1 x 1 port matrix configuration. Operating reliably in a wide temperature range from -55 to 105°C (-67 to 221°F), this assembly is perfect for demanding environments. Compliant with RoHS regulations, it's a sustainable choice for your connectivity needs, whether in data centers, telecommunications, or industrial applications.
Availability
In Stock:
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Stock Location:
In Stock
Factory Stock:
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Factory Lead:
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Unit Of Measure:
Each
Minimum/Multiple:
1/1
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Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |