2267254-3

Heilind Number:AMP2267254-3
Manufacturer:TE Connectivity
Manufacturer Number:2267254-3
ECAD Model:
3D Model

Description:

30 50/50 GRID DRST TH RCPT

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2267254-3
Amperage:.5 A
Housing Material:Liquid Crystal Polymer
Number of Rows:2
Termination Method:Through Hole - Solder
Contact Material:Copper Alloy
Pitch:.05 in, 1.27 mm
Contact Type:Receptacle
Row Spacing:.05 in, 1.27 mm
Number of Positions:30
Mount Orientation:Vertical
Contact Mating Area Plating:Gold
Stack Height:.25 in, .32 in, .39 in, 6.35 mm, 8.12 mm, 9.9 mm
Product:Board-to-Board Headers & Receptacles
SKU:AMP2267254-3

Detailed Description

Enhance your PCB connectivity with this high-performance board-to-board receptacle. Featuring a robust Liquid Crystal Polymer housing and Copper Alloy contacts plated with gold, it ensures reliable power delivery at a low amperage of .5 A. With a compact design, it offers 30 positions in a vertical orientation, perfect for space-saving installations. The through-hole solder termination method guarantees secure attachment, while the 1.27mm pitch and .05in row spacing facilitate easy integration. Choose from multiple stack heights to suit your application's requirements, all while meeting RoHS compliance standards. Upgrade your connectivity solutions with this dependable connector, ideal for mezzanine and board stacking applications.