| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2267254-4 |
| Amperage: | .5 A |
| Housing Material: | Liquid Crystal Polymer |
| Number of Rows: | 2 |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Copper Alloy |
| Pitch: | .05 in, 1.27 mm |
| Contact Type: | Receptacle |
| Row Spacing: | .05 in, 1.27 mm |
| Number of Positions: | 40 |
| Mount Orientation: | Vertical |
| Contact Mating Area Plating: | Gold |
| Stack Height: | .25 in, .32 in, .39 in, 6.35 mm, 8.12 mm, 9.9 mm |
| Product: | Board-to-Board Headers & Receptacles |
| SKU: | AMP2267254-4 |
2267254-4
| Heilind Number: | AMP2267254-4 |
| Manufacturer: | TE Connectivity |
| Manufacturer Number: | 2267254-4 |
| ECAD Model: | |
Specifications
Detailed Description
Enhance your PCB connectivity with this high-performance board-to-board connector. Featuring a durable liquid crystal polymer housing, it ensures reliable power transmission with a low amperage of 0.5 A. Designed for easy installation, the through-hole solder termination method guarantees secure attachment. Its two rows of 40 gold-plated receptacles offer seamless vertical stacking, with a 1.27 mm pitch and 1.27 mm row spacing. The copper alloy contact material provides optimal conductivity, while the varied stack heights offer flexibility in assembly. Perfect for demanding applications, this connector is a must-have for any electronic project.
