2267254-9

Heilind Number:AMP2267254-9
Manufacturer:TE Connectivity
Manufacturer Number:2267254-9
ECAD Model:
3D Model

Description:

90 50/50 GRID DRST TH RCPT

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2267254-9
Amperage:.5 A
Housing Material:Liquid Crystal Polymer
Number of Rows:2
Termination Method:Through Hole - Solder
Contact Material:Copper Alloy
Pitch:.05 in, 1.27 mm
Contact Type:Receptacle
Row Spacing:.05 in, 1.27 mm
Number of Positions:90
Mount Orientation:Vertical
Contact Mating Area Plating:Gold
Stack Height:.25 in, .32 in, .39 in, 6.35 mm, 8.12 mm, 9.9 mm
Product:Board-to-Board Headers & Receptacles
SKU:AMP2267254-9

Detailed Description

Enhance your PCB connectivity with this high-performance board-to-board receptacle, designed for seamless integration in electronic assemblies. Featuring a liquid crystal polymer housing and gold-plated copper alloy contacts, it ensures reliable signal transmission. With a pitch of 1.27mm (.05in) and 90 positions spread across 2 rows, it offers efficient connectivity for your electronic components. The through-hole solder termination method guarantees secure attachment to the PCB. Its vertical mount orientation and various stack heights provide versatility in assembly configurations. Compliant with RoHS regulations, this connector is a sustainable choice for your application. Ideal for use in mezzanine and board stacking setups, it is a essential component for your electronic projects.