2267261-3

Heilind Number:AMP2267261-3
Manufacturer:TE Connectivity
Manufacturer Number:2267261-3
ECAD Model:
3D Model

Description:

30 50/50 GRID DR TH/PiP RCPT VC

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2267261-3
Amperage:.5 A
Housing Material:Liquid Crystal Polymer
Number of Rows:2
Termination Method:Through Hole - Solder
Contact Material:Copper Alloy
Pitch:.05 in, 1.27 mm
Contact Type:Receptacle
Row Spacing:.05 in, 1.27 mm
Number of Positions:30
Mount Orientation:Vertical
Contact Mating Area Plating:Gold
Stack Height:.25 in, .32 in, .39 in, 6.35 mm, 8.12 mm, 9.9 mm
Product:Board-to-Board Headers & Receptacles
SKU:AMP2267261-3

Detailed Description

Enhance your PCB connectivity with this high-performance board-to-board connector. With a sleek design and durable liquid crystal polymer housing, it offers reliable performance in any environment. Featuring two rows of 30 receptacles, it ensures seamless data transmission. The through-hole solder termination method guarantees secure attachment, while the gold-plated contact mating area provides optimal conductivity. With multiple stack heights available, including .32 in, .39 in, and .25 in, it offers versatility in your design. RoHS compliant and crafted with copper alloy contacts, this connector is a must-have for your electronic projects. Elevate your PCB assembly with this superior mezzanine and board stacking solution.