2267261-4

Heilind Number:AMP2267261-4
Manufacturer:TE Connectivity
Manufacturer Number:2267261-4
ECAD Model:
3D Model

Description:

40 50/50 GRID DR TH/PiP RCPT VC

More >>

Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2267261-4
Amperage:.5 A
Housing Material:Liquid Crystal Polymer
Number of Rows:2
Termination Method:Through Hole - Solder
Contact Material:Copper Alloy
Pitch:.05 in, 1.27 mm
Contact Type:Receptacle
Row Spacing:.05 in, 1.27 mm
Number of Positions:40
Mount Orientation:Vertical
Contact Mating Area Plating:Gold
Stack Height:.25 in, .32 in, .39 in, 6.35 mm, 8.12 mm, 9.9 mm
Product:Board-to-Board Headers & Receptacles
SKU:AMP2267261-4

Detailed Description

This high-performance board-to-board connector features a low amperage of .5 A, making it ideal for various electronic applications. With a housing made of Liquid Crystal Polymer and contact material crafted from Copper Alloy, it ensures durability and reliable conductivity. The connector offers two rows with a total of 40 positions, each featuring a gold-plated contact mating area for optimal signal transfer. Its through-hole solder termination method and vertical mount orientation provide easy and secure installation on PCBs. With a pitch of 1.27 mm (.05 in) and row spacing of .05 in, it allows for efficient board stacking. The stack height can be adjusted to .32 in, .39 in, or .25 in (6.35 mm, 9.9 mm, 8.12 mm), offering versatility in design. This connector is a crucial component for achieving seamless connectivity in electronic assemblies.