2267261-6

Heilind Number:AMP2267261-6
Manufacturer:TE Connectivity
Manufacturer Number:2267261-6
ECAD Model:
3D Model

Description:

60 50/50 GRID DR TH/PiP RCPT VC

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2267261-6
Amperage:.5 A
Housing Material:Liquid Crystal Polymer
Number of Rows:2
Termination Method:Through Hole - Solder
Contact Material:Copper Alloy
Pitch:.05 in, 1.27 mm
Contact Type:Receptacle
Row Spacing:.05 in, 1.27 mm
Number of Positions:60
Mount Orientation:Vertical
Contact Mating Area Plating:Gold
Stack Height:.25 in, .32 in, .39 in, 6.35 mm, 8.12 mm, 9.9 mm
Product:Board-to-Board Headers & Receptacles
SKU:AMP2267261-6

Detailed Description

Enhance your board-to-board connections with this high-performance receptacle, designed for seamless integration in your PCB assembly. Featuring a durable Liquid Crystal Polymer housing and copper alloy contacts plated with gold, it ensures reliable conductivity and longevity. With a pitch of 1.27mm, row spacing of 1.27mm, and through-hole solder termination method, it offers easy installation and secure attachment. The vertical mount orientation and stack height options provide flexibility for various configurations. With 60 positions spread across two rows, it's perfect for applications requiring multiple connections. Compliant with RoHS standards, it's a sustainable choice for your electronic designs. Elevate your PCB connectivity with this top-quality component.