2267261-7

Heilind Number:AMP2267261-7
Manufacturer:TE Connectivity
Manufacturer Number:2267261-7
ECAD Model:
3D Model

Description:

70 50/50 GRID DR TH/PiP RCPT VC

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2267261-7
Amperage:.5 A
Housing Material:Liquid Crystal Polymer
Number of Rows:2
Termination Method:Through Hole - Solder
Contact Material:Copper Alloy
Pitch:.05 in, 1.27 mm
Contact Type:Receptacle
Row Spacing:.05 in, 1.27 mm
Number of Positions:70
Mount Orientation:Vertical
Contact Mating Area Plating:Gold
Stack Height:.25 in, .32 in, .39 in, 6.35 mm, 8.12 mm, 9.9 mm
Product:Board-to-Board Headers & Receptacles
SKU:AMP2267261-7

Detailed Description

Enhance your PCB connectivity with this high-performance board-to-board receptacle connector. Designed for seamless integration into your electronic assemblies, it features durable Liquid Crystal Polymer housing and Copper Alloy contacts for reliable power transmission. With a compact pitch of 1.27mm (.05 in) and 70 positions spread across 2 rows, it offers efficient signal routing in tight spaces. The vertical mount orientation and through-hole solder termination method ensure secure attachment to your PCB. Gold-plated contact mating areas guarantee optimal conductivity, while the stackable design allows for versatile stacking heights (.32 in, .39 in, .25 in, 6.35 mm, 9.9 mm, 8.12 mm). Compliant with RoHS regulations, this connector is ideal for applications requiring high-speed data transfer and signal integrity. Upgrade your connectivity solutions with this essential component for Mezzanine & Board Stacking connections.