| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2267261-9 |
| Amperage: | .5 A |
| Housing Material: | Liquid Crystal Polymer |
| Number of Rows: | 2 |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Copper Alloy |
| Pitch: | .05 in, 1.27 mm |
| Contact Type: | Receptacle |
| Row Spacing: | .05 in, 1.27 mm |
| Number of Positions: | 90 |
| Mount Orientation: | Vertical |
| Contact Mating Area Plating: | Gold |
| Stack Height: | .25 in, .32 in, .39 in, 6.35 mm, 8.12 mm, 9.9 mm |
| Product: | Board-to-Board Headers & Receptacles |
| SKU: | AMP2267261-9 |
2267261-9
| Heilind Number: | AMP2267261-9 |
| Manufacturer: | TE Connectivity |
| Manufacturer Number: | 2267261-9 |
| ECAD Model: | |
Specifications
Detailed Description
Enhance your PCB connectivity with this high-quality board-to-board receptacle connector. Designed for optimal performance, it features a durable liquid crystal polymer housing and copper alloy contacts with gold plating. With a pitch of 1.27mm and 90 positions, it offers efficient signal transmission in a vertical mount orientation. The through-hole solder termination method ensures secure installation, while the stack heights of .32in, .39in, and .25in provide versatility for various applications. RoHS compliant, this connector is a reliable choice for your electronic assembly needs.
