| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2302785-2 |
| Series: | MULTIGIG RT 3 |
| Amperage: | 1 A |
| Connector Type: | Daughtercard (Plug) |
| Gender: | Plug |
| Housing Material: | LCP - GF (Liquid Crystal Polymer) |
| Number of Rows: | 7 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Pitch: | .075 in, 1.8 mm |
| Row Spacing: | .053 in, 1.35 mm |
| Impedance: | 100 Ω |
| Number of Pairs: | 32 |
| Number of Positions: | 112 |
| Mount Orientation: | Right Angle |
| GPL: | B54 |
| Operating Temperature Range: | , |
| Circuit Application: | Signal |
| Sealable: | No |
| Mating Alignment: | Guide Hardware |
| Mating Alignment Type: | Keyed |
| GPL Description: | Aerospace Defense & Marine |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | X942 |
| Number of Columns: | 16 |
| Number of Signal Positions: | 8 |
| Connector System: | Board to Board |
| Connector Product Type: | Daughtercard Connector |
| Pairs Per Column: | 2 |
| Board to Board Configuration: | Right Angle |
| Shroud Type: | No |
| Card Slot Centerline: | 20.3 mm, .8 in |
| Guide Location: | Unguided |
| Number of Ground Positions: | 40 |
| Signal Arrangement: | Differential |
| Part Aliases: | 2302785-2 |
| SKU: | AMP2302785-2 |
2302785-2
Specifications
Detailed Description
The Multigig RT 3 RA Plug Assembly features a 7-row design, ideal for center VPX applications in the aerospace, defense, and marine industries. With an ampere rating of 1A, this daughtercard connector offers reliable signal transmission. The plug housing is constructed from durable LCP-GF, ensuring longevity in harsh environments. It boasts 112 positions in a right-angle mount orientation, with a 1.8mm pitch and 100Ω impedance for optimal performance. Each of the 32 pairs is carefully arranged for differential signaling, meeting RoHS compliance standards. Designed for board-to-board configurations, this connector is essential for high-speed data transmission in mission-critical systems.
For Use With
| Product | Part # | Description | Stock |
|---|---|---|---|
 | TE Connectivity 2364030-2 |  |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 11/17/2025 | P-25-028147 - Product Improvement. Current Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification. | Download | |||
| 08/08/2025 | P-25-028110 - Product improvement. Reduce FOD (Foreign Object Debris) during assembly process. Design of the organizer s mattel pin holes change from hexagon shape to oblong shape to reduce insertion interference between the organizer holes and the shroud s pin during assembly process. This change does not have an impact on performance and does not cause compatibility issues. | Download | |||
| 07/01/2024 | P-24-025925 - Product Improvement. Reducing the wafer slot width of the shroud, from 0.45mm to legacy 0.36mm. This change does not have an impact on performance and does not cause compatibility issues. Previous change increased the slot width to 0.45mm but did not remove the chamfered profile in the slot, which was later determine to be the root cause of the FOD in our assembly process | Download | |||
Availability
In Stock:
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Stock Location:
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Factory Stock:
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Unit Of Measure:
Each
Minimum/Multiple:
1/1
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Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |