| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2313237-1 |
| Series: | MULTIGIG RT 3 |
| Amperage: | 1 A |
| Connector Type: | Daughtercard (Plug) |
| Gender: | Plug |
| Housing Material: | LCP - GF (Liquid Crystal Polymer) |
| Number of Rows: | 7 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Pitch: | .075 in, 1.8 mm |
| Row Spacing: | .053 in, 1.35 mm |
| Impedance: | 100 Ω |
| Number of Pairs: | 20 |
| Number of Positions: | 112 |
| Mount Orientation: | Right Angle |
| Circuit Application: | Power & Signal |
| Sealable: | No |
| Mating Alignment: | Guide Hardware |
| Mating Alignment Type: | Keyed |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Number of Columns: | 16 |
| Number of Power Positions: | 6 |
| Number of Signal Positions: | 20 |
| Connector System: | Board to Board |
| Connector Product Type: | Daughtercard Connector |
| Pairs Per Column: | 2 |
| Board to Board Configuration: | Right Angle |
| Shroud Type: | No |
| Card Slot Centerline: | 20.3 mm, .8 in |
| Guide Location: | Unguided |
| Number of Ground Positions: | 31 |
| Signal Arrangement: | Differential Signaling & Single Ended |
| Part Aliases: | null 2313237-1 |
| SKU: | AMP2313237-1 |
2313237-1
| Heilind Number: | AMP2313237-1 |
| Manufacturer: | TE Connectivity |
| Manufacturer Number: | 2313237-1 |
| Datasheet: | 3D Drawing |
| ECAD Model: |
Specifications
Detailed Description
Easily connect and power up your high-speed electronic devices with our RAPLUGASSY, featuring a MULTIGIG RT 3 series design. With a robust amperage of 1A, this daughtercard connector ensures reliable performance. Crafted with durable LCP - GF housing material, it guarantees longevity. Boasting 112 positions and 20 pairs, including 6 power and 20 signal positions, it offers versatile connectivity options. Its right-angle mount orientation and board-to-board configuration make installation a breeze. Perfect for power and signal applications, this connector is ideal for aerospace, defense, marine, and other demanding environments. RoHS compliant and designed for through-hole press-fit termination, it meets the highest quality standards. Whether you're in the field of products, connectors, or PCB accessories, this connector is a must-have for seamless electronic integration.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 01/12/2026 | PCN-25-266689 - Drawing Change. On TE Customer Drawing change 1.41 dimension to 1.41 REF, change 1.20 to 1.20 REF. | Download | |||
| 11/17/2025 | P-25-028147 - Product Improvement. Current Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification. | Download | |||
| 10/15/2025 | P-25-029003 - New manufacturing facility. Outside vendor currently producing the metal Alignment pins used in Multigig Daughtercard assemblies is moving manufacturing to a new facility. Facility is in same general area as existing plant in USA. | Download | |||
| 08/08/2025 | P-25-028110 - Product improvement. Reduce FOD (Foreign Object Debris) during assembly process. Design of the organizer s mattel pin holes change from hexagon shape to oblong shape to reduce insertion interference between the organizer holes and the shroud s pin during assembly process. This change does not have an impact on performance and does not cause compatibility issues. | Download | |||
| 07/01/2024 | P-24-025925 - Product Improvement. Reducing the wafer slot width of the shroud, from 0.45mm to legacy 0.36mm. This change does not have an impact on performance and does not cause compatibility issues. Previous change increased the slot width to 0.45mm but did not remove the chamfered profile in the slot, which was later determine to be the root cause of the FOD in our assembly process | Download | |||

