3-100159-0

Heilind Number:AMP3-100159-0
Manufacturer:TE Connectivity
Manufacturer Number:3-100159-0
Datasheet:2D Model (DXF)
ECAD Model:
3D Model

Description:

2MM HDR, 55 POS EXTN MOD

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 3-100159-0
Series:Z-PACK 2mm HM
Number of Rows:5
Mount Type:Board Mount
Pitch:.078 in, 2 mm
Contact Type:Pin
Number of Positions:55
Data Rate:≤1 Gb/s
Housing Color:Gray
Mount Orientation:Vertical
GPL:472
Packaging:Tube
Operating Temperature Range:-55 - 125 °C, -67 - 257 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin, .76 µm
Sealable:No
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:6251
Number of Columns:11
Connector System:Board to Board
ECCN:EAR99
Board to Board Configuration:Backplane
Connector Assembly Type:PCB Mount Header
CompactPCI Designation:None
Part Aliases:3-100159-0
SKU:AMP3-100159-0

Detailed Description

Introducing the Z-PACK 2mm HM series, a high-performance board-to-board connector designed for signal transmission in demanding environments. With five rows of 11 pins each, totaling 55 positions, this connector offers reliable connectivity with a pitch of 2mm (.078 in). Featuring gold plating in the contact mating area, it ensures optimal signal integrity with a data rate of up to 1 Gb/s. The vertical mount orientation and board mount design make it suitable for backplane configurations, while its rugged construction allows for operation in a wide temperature range (-55 to 125°C, -67 to 257°F). Ideal for applications in data and devices, this connector is a crucial component for high-speed signal transmission in electronic systems. With RoHS compliance and ECCN designation as EAR99, it meets international standards for environmental responsibility and export regulations. Trust the Z-PACK 2mm HM for seamless board-to-board connections in your next project.