| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 3-1827233-6 |
| Amperage: | .5 A |
| Housing Material: | High Temperature Thermoplastic |
| Number of Rows: | 4 |
| Mount Type: | Board Mount |
| Termination Method: | Surface Mount |
| Contact Material: | Copper Alloy |
| Contact Plating: | Gold |
| Body Orientation: | Straight |
| Pitch: | .02 in, 5 mm |
| Voltage: | 50 V AC |
| Contact Type: | Pin |
| Package Quantity: | 72 |
| Contact Amperage: | .5 A |
| Number of Positions: | 440 |
| Housing Color: | Black |
| Mount Orientation: | Vertical |
| Insulation Resistance: | 4 MΩ |
| GPL: | 312 |
| Packaging: | Hard Tray |
| Operating Temperature Range: | -40 - 185 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .2 µm, 7.874 µin |
| PCB Retention: | With |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | .2 in |
| Connector Height: | .175 in, 4.45 mm |
| PCB Retention Type: | Solder Peg |
| Ground Component Type: | Grounding Contact, Grounding Plate |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | A198 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | Yes |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 200 V AC |
| Board to Board Configuration: | Mezzanine |
| Contact Shape: | Square |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Locating Posts |
| Application Assembly Feature: | None |
| Connector Assembly Type: | PCB Mount Header |
| Stack Height: | .197 in, 5 mm |
| PCB Contact Termination Area Plating Thickness: | 1 µm, 39.37 µin |
| Contact Mating Area Length: | 1.3 mm, 1 mm |
| Temperature Rating: | High |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 1377801 3-1827233-6 |
| SKU: | AMP3-1827233-6 |
3-1827233-6
Specifications
Detailed Description
Our MIL-PRF-29504 compliant board-to-board PCB connector is designed for high-performance signal applications, featuring four rows of .5 A pins for reliable connectivity. Made with a high-temperature thermoplastic housing in a sleek black finish, it ensures durability in harsh operating conditions. The surface-mount termination with gold-plated copper alloy contacts guarantees optimal conductivity, with a voltage rating of 50 V AC. With 440 positions and a compact .5 mm pitch, it offers efficient signal transmission in a straight orientation. UL 94V-0 certified for flammability, it meets stringent safety standards. Ideal for mezzanine configurations, this connector is stackable and features solder peg PCB retention for secure mounting. Its versatility and performance make it a top choice for data and device applications in various industries. Fully RoHS compliant, it aligns with environmental regulations, making it a sustainable solution for your connectivity needs.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 02/01/2024 | P-23-025452 - Manufacturing location change. Following Part Numbers will be transferred from TE leased site in Qingdao high tech zone to TE main campus in Qingdao for Data and Devices business unit. Qingdao high tech zone also runned by TE production under TE quality control system. Operator/Tooling/Process is not changed and just manufacturing location change | Download | |||
| 01/08/2023 | PCN-22-157376 - Tray Change. Add a littler error feature in hard tray To be better efficiency visual inspection in plant. To better visual inspection and consider modifying package Consider an error-proof method in hard tray to convenient inspector to appearance inspection | Download | |||
| 06/27/2022 | P-22-022958 - Manufacturing Location Change. Following Part Numbers will be transferred from current TE Connectivity AMP Qingdao manufacturing location, CHINA to new manufacturing location- TE AMP Qingdao Ltd. High-tech Zone Branch is 11KM from TE current Campus, which was located in Graphene Industrial Park in Qingdao. | Download | |||
| 10/25/2021 | P-21-021630 - Manufacturing location change. Following Part Numbers will be transferred from TE AMP QD limited to TM AMP QD Ltd High-Tech Zone Branch. | Download | |||
| 08/24/2021 | PCN-21-111259 - customer request. add mated condition info in the drawings | Download | |||
| 08/24/2020 | P-20-019477 - Cancellation of PCN E-20-000066-C remaining and implement the original PCN:E-20-000066. Document clarification.PCN that name E-20-000066-C have been created and submitted is a operating mistake during engineering change system workflow. | Download | |||
| 07/10/2020 | E-20-000066 - Product Improvement. Change solder tail plating from Tin to gold flash. | Download | |||
| 08/15/2018 | P-18-015503 - Manufacturing location change. | Download | |||
| 08/15/2018 | P-18-015536 - Manufacturing location change. | Download | |||
| 03/01/2018 | P-18-015535 - Cancellation of P-18-015503. | Download | |||
| 09/04/2017 | P-17-014700 - Manufacturing Location Change. | Download | |||
| 09/01/2017 | P-17-014467 - Manufacturing location change. Following Part Numbers will be transferred from TE Japan to TE Qingdao. | Download | |||
| 06/19/2017 | P-17-014514 - Cancel previous PCN: P-17-014467 due to incorrect "Estimated First Date To Ship Changed Parts", "Estimated Last Date for Mixed Shipments", and so on. | Download | |||
| 01/31/2017 | E-16-010529 - Document Clarification. Part version upgrade to align with PD, and change LOGO on housing from AMP to TE. | Download | |||

