3-331272-4

Heilind Number:AMP3-331272-4
Manufacturer:TE Connectivity
Manufacturer Number:3-331272-4
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SOCKET,MIN-SPR W/KO AU SER-2

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 3-331272-4
Series:Series 3
Amperage:5 A
Termination Method:Through Hole - Press-Fit
Contact Material:Beryllium Copper
Contact Type:Socket
Socket Type:Discrete
Hole Size:.052 in, 1.32 mm
Cable Type:Discrete Wire
Contact Amperage:5 A
GPL:377
Profile:Zero
Packaging:Bag, Loose Piece
Operating Temperature Range:-65 - 125 °C, -85 - 257 °F
Circuit Application:Power & Signal
PCB Thickness (Recommended):.031 - .125 in, .79 - 3.18 mm
Sealable:No
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:3076
Wire Size:.205 - .258 mm², 23 - 24 AWG
Contact Transmits:Signal/Power
Pin Diameter Accepted:.022 - .025 in, .56 - .64 mm
Connector System:Cable-to-Board
ECCN:EAR99
Spring Material:Beryllium Copper
Socket Length:.138 in, 3.51 mm
Sleeve Material:Copper
Sleeve Plating:Gold Flash over Nickel
Sealant:No
Contact Spring Plating Material:Gold
Sleeve Style:Knockout Bottom
Insertion Method:Hand/Semi-Automatic
Part Aliases:3-331272-4
SKU:AMP3-331272-4

Detailed Description

Enhance your electronic connections with our MIN-SPR W/KO AU SER-2 SOCKET. Designed for Series 3 applications, this component features a 5 A amperage rating and Through Hole - Press-Fit termination method for secure attachment to your PCB. Crafted from durable Beryllium Copper, it ensures reliable conductivity. Its Discrete Socket type with a .052 inch hole size accommodates various cable types, making it ideal for power and signal circuit applications. With a Zero profile and operating temperature range of -65 to 125°C, it offers versatility in use. RoHS compliant and featuring Gold Flash plating, it guarantees high performance and longevity in your electronic assemblies. Upgrade your connectivity with this essential component.