| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 3-5223081-1 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 5 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Pin |
| Impedance: | 60 Ω |
| Package Quantity: | 24 |
| Contact Amperage: | 3 A |
| Number of Positions: | 60 |
| Housing Color: | Natural |
| Mount Orientation: | Vertical |
| Insulation Resistance: | 5 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Power & Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .05 µm, 1.969 µin |
| PCB Retention: | With |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | .05 in, 1.3 mm |
| Connector Height: | 17 mm, .668 in |
| PCB Retention Type: | Action/Compliant Tail |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 3964 |
| Number of Signal Positions: | 60 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 1000 V AC |
| Board to Board Configuration: | Vertical |
| Connector Width: | 18 mm, .709 in |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Post Polarization |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .167 in, 4.25 mm |
| Connector Assembly Type: | PCB Mount Header |
| PCB Contact Termination Area Plating Thickness: | .06 µm, 2.362 µin |
| Mating / Unmating Configuration: | Sequencing |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 3-5223081-1 |
| SKU: | AMP3-5223081-1 |
3-5223081-1
Specifications
Detailed Description
Enhance your PCB connections with the Z-PACK Future Bus+ Board-to-Board Connector. Featuring a rugged LCP housing and press-fit termination method, this connector ensures reliable performance in demanding environments. With 60 gold-plated pin contacts, it supports power and signal transmission at up to 3A and 30V AC, ideal for high-speed data and device applications. The 5-row, 2mm pitch design offers a compact footprint, while UL 94V-0 flammability rating guarantees safety. Its vertical mount orientation and polarization alignment simplify assembly, while the 1000V AC dielectric withstanding voltage ensures robust insulation. RoHS compliant and suitable for temperatures ranging from -67 to 257°F, this connector is a versatile solution for your connectivity needs.

