3-5646547-0

Heilind Number:AMP3-5646547-0
Manufacturer:TE Connectivity
Manufacturer Number:3-5646547-0
Datasheet:Drawing
ECAD Model:
3D Model

Description:

Z-PACK A-B 25 COLUMN SHLD ASSY

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 3-5646547-0
Series:Z-PACK 2mm HM
Number of Rows:5
Mount Type:Board Mount
Pitch:.078 in, 2 mm
Contact Type:Socket
Number of Positions:125
Data Rate:≤1 Gb/s
Housing Color:Gray
Mount Orientation:Right Angle
GPL:472
Packaging:Tube
Operating Temperature Range:-55 - 125 °C, -67 - 257 °F
Circuit Application:Power & Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin, .76 µm
Sealable:No
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:6250
Number of Columns:25
Connector System:Board to Board
ECCN:EAR99
Board to Board Configuration:Backplane
Connector Assembly Type:PCB Mount Receptacle
CompactPCI Designation:None
Part Aliases:3-5646547-0
SKU:AMP3-5646547-0

Detailed Description

Enhance connectivity with the Z-PACK A-B 25 COLUMN SHLD ASSY from our Z-PACK 2mm HM series. Featuring five rows of high-speed sockets, this board-mountable assembly is designed for seamless power and signal transmission in demanding environments. With a 2mm pitch and 125 positions, it supports data rates of up to 1 Gb/s, ensuring reliable performance. The right-angle mount orientation and durable gray housing make it versatile for various applications. Gold-plated contact mating areas guarantee optimal conductivity, while a wide operating temperature range of -55 to 125°C (-67 to 257°F) ensures suitability for harsh conditions. Ideal for PCB-to-PCB connections in backplane configurations, this RoHS-compliant assembly is a must-have for your connectivity needs.