5-102449-6

Heilind Number:AMP5-102449-6
Manufacturer:TE Connectivity
Manufacturer Number:5-102449-6
Datasheet:Statement of Compliance
ECAD Model:
3D Model

Description:

MT RECP LP SN

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5-102449-6
Series:AMPMODU IV/V
Termination Method:Crimp, Insulation Displacement Crimp (IDC)
Contact Material:Copper Alloy
Contact Type:Socket
Package Quantity:500
GPL:283
Packaging:Bag
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin
Contact Underplating Material:Nickel
PCB Contact Termination Area Plating:Tin
GPL Description:Industrial
Product Code:5966
Wire Size:22 - 20 AWG, .3 - .6 mm²
ECCN:EAR99
PCB Contact Termination Area Plating Finish:Matte
Applied_Pressure:Standard
Wire Insulation Support:With
Accepts Wire Insulation Diameter:.05 in, 1.27 mm
PCB Contact Termination Area Plating Thickness:50 µin
Wire Contact Termination Area Plating Material:Tin
Wire Contact Termination Area Plating Thickness:50 µin
Part Aliases:5-102449-6
SKU:AMP5-102449-6

Detailed Description

Enhance your connectivity with our MT RECP LP SN Crimp Wire Contacts. Part of the AMPMODU IV/V series, these contacts are designed for efficient termination via Crimp or Insulation Displacement Crimp (IDC) methods, ensuring secure connections every time. With a contact material of Copper Alloy and a Gold plating in the mating area, they offer reliable performance in industrial settings. Suitable for wire sizes 22-20 AWG (.3-.6 mm²), they accommodate various applications with ease. RoHS compliant and featuring nickel underplating, these contacts prioritize both environmental responsibility and durability. Whether you're working on a small project or a large-scale industrial application, these contacts, packaged in quantities of 500, are a dependable choice for your connectivity needs.