5-146277-4

Heilind Number:AMP5-146277-4
Manufacturer:TE Connectivity
Manufacturer Number:5-146277-4
ECAD Model:
3D Model

Description:

04 MODII HDR SRST B/A .100CL

More >>

Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5-146277-4
Amperage:3 A
Housing Material:Liquid Crystal Polymer
Number of Rows:1
Termination Method:Through Hole - Solder
Contact Material:Copper Alloy
Pitch:.1 in, 2.54 mm
Contact Type:Pin
Number of Positions:4
Mount Orientation:Vertical
Contact Mating Area Plating:Gold
Header Type:Breakaway
Product:Board-to-Board Headers & Receptacles
SKU:AMP5-146277-4

Detailed Description

Enhance your board-to-board connectivity with this cutting-edge header, featuring a vertical mount orientation for seamless integration. Designed for through-hole solder termination, it ensures secure and reliable connections in your electronic assemblies. With a compact footprint and 2.54mm pitch, it's ideal for space-constrained applications. Boasting a durable Liquid Crystal Polymer housing and gold-plated copper alloy contacts, it guarantees long-lasting performance even in demanding environments. This RoHS-compliant component with four positions and a single row configuration is essential for efficient PCB interconnection. Upgrade your systems with this high-quality solution for mezzanine and board stacking connections.