5-2267254-7

Heilind Number:AMP5-2267254-7
Manufacturer:TE Connectivity
Manufacturer Number:5-2267254-7
ECAD Model:
3D Model

Description:

70 50/50 GRID DRST TH RCPT

More >>

Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5-2267254-7
Amperage:.5 A
Housing Material:Liquid Crystal Polymer
Number of Rows:2
Termination Method:Through Hole - Solder
Contact Material:Copper Alloy
Pitch:.05 in, 1.27 mm
Contact Type:Receptacle
Row Spacing:.05 in, 1.27 mm
Number of Positions:70
Mount Orientation:Vertical
Contact Mating Area Plating:Gold
Stack Height:.25 in, .32 in, .39 in, 6.35 mm, 8.12 mm, 9.9 mm
Product:Board-to-Board Headers & Receptacles
SKU:AMP5-2267254-7

Detailed Description

Enhance your PCB connectivity with this high-performance board-to-board connector. Designed for seamless integration, it features a through-hole solder termination method and a robust housing made of liquid crystal polymer. With two rows of 70 receptacles, it offers reliable contact through its copper alloy construction and gold plating. The precise 1.27mm pitch and .05in row spacing ensure optimal signal transmission. Its vertical mount orientation and stack heights ranging from 6.35mm to 9.9mm provide flexibility in installation. Ideal for demanding applications, this connector is RoHS compliant, meeting the latest environmental standards. Elevate your connectivity solutions with this essential component for Mezzanine & Board Stacking configurations.