| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5-2267261-2 |
| Amperage: | .5 A |
| Housing Material: | Liquid Crystal Polymer |
| Number of Rows: | 2 |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Copper Alloy |
| Pitch: | .05 in, 1.27 mm |
| Contact Type: | Receptacle |
| Row Spacing: | .05 in, 1.27 mm |
| Number of Positions: | 20 |
| Mount Orientation: | Vertical |
| Contact Mating Area Plating: | Gold |
| Stack Height: | .25 in, .32 in, .39 in, 6.35 mm, 8.12 mm, 9.9 mm |
| Product: | Board-to-Board Headers & Receptacles |
| SKU: | AMP5-2267261-2 |
5-2267261-2
| Heilind Number: | AMP5-2267261-2 |
| Manufacturer: | TE Connectivity |
| Manufacturer Number: | 5-2267261-2 |
| ECAD Model: | |
Specifications
Detailed Description
Enhance your board-to-board connectivity with this high-performance receptacle, designed for seamless through-hole solder installation. Featuring a durable Liquid Crystal Polymer housing and precision-engineered Copper Alloy contacts plated with gold, it ensures reliable signal transmission in demanding environments. With 20 positions arranged in 2 rows at a pitch of 1.27mm (.05 inches) and a stack height ranging from .25 to 9.9mm (.32 to .39 inches), it offers versatility for various applications. Its vertical mount orientation and RoHS compliance make it ideal for environmentally conscious projects. Elevate your PCB connectivity with this top-of-the-line component.
