5-2267261-9

Heilind Number:AMP5-2267261-9
Manufacturer:TE Connectivity
Manufacturer Number:5-2267261-9
ECAD Model:
3D Model

Description:

90 50/50 GRID TH/PiP RCPT VC LF

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5-2267261-9
Amperage:.5 A
Housing Material:Liquid Crystal Polymer
Number of Rows:2
Termination Method:Through Hole - Solder
Contact Material:Copper Alloy
Pitch:.05 in, 1.27 mm
Contact Type:Receptacle
Row Spacing:.05 in, 1.27 mm
Number of Positions:90
Mount Orientation:Vertical
Contact Mating Area Plating:Gold
Stack Height:.25 in, .32 in, .39 in, 6.35 mm, 8.12 mm, 9.9 mm
Product:Board-to-Board Headers & Receptacles
SKU:AMP5-2267261-9

Detailed Description

This high-performance board-to-board connector features a 0.5A amperage, making it ideal for various electronic applications. With a housing material of Liquid Crystal Polymer and copper alloy contact material, it ensures durability and reliability. The connector offers 90 positions in a vertical mount orientation, with a pitch of 1.27mm (.05 in) for precise connectivity. Through-hole solder termination and gold contact plating guarantee secure and efficient signal transmission. Its stack height options of .32in, .39in, and .25in (6.35mm, 9.9mm, 8.12mm) accommodate different spacing requirements. RoHS compliance further underscores its quality and environmental responsibility, making it a trusted choice for board stacking and mezzanine applications in various industries.