5-5330808-4

Heilind Number:AMP5-5330808-4
Manufacturer:TE Connectivity
Manufacturer Number:5-5330808-4
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SOCKET,MIN-SPR W/H SN-AU SER-1

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5-5330808-4
Termination Method:Through Hole - Press-Fit
Contact Material:Beryllium Copper
Contact Type:Socket
Socket Type:Discrete
Hole Size:.041 in, 1.04 mm
Cable Type:Discrete Wire
Contact Amperage:3 A
GPL:377
Profile:Zero
Packaging:Bag, Loose Piece
Operating Temperature Range:-65 - 125 °C, -85 - 257 °F
Circuit Application:Signal
PCB Thickness (Recommended):.031 - .125 in, .79 - 3.18 mm
Sealable:No
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:3076
Wire Size:.0404 - .081 mm², 28 - 31 AWG
Contact Transmits:Signal/Power
Pin Diameter Accepted:.01 - .013 in, .25 - .33 mm
Connector System:Cable-to-Board
ECCN:EAR99
Spring Material:Beryllium Copper
Socket Length:.142 in, 3.61 mm
Sleeve Material:Copper
Sleeve Plating:Tin
Sealant:No
Contact Spring Plating Material:Gold
Sleeve Style:Open Bottom
Insertion Method:Hand/Semi-Automatic
Part Aliases:5-5330808-4
SKU:AMP5-5330808-4

Detailed Description

Enhance your electronic assemblies with this high-quality SOCKET,MIN-SPR W/H SN-AU SER-1. Designed for Through Hole - Press-Fit termination, it features Beryllium Copper contacts for reliable performance. With a contact amperage of 3A, it is suitable for signal applications. The socket, with a hole size of .041 in, accommodates 28-31 AWG wires. Its Zero profile and operating temperature range of -65 to 125°C make it versatile for various environments. Ideal for Cable-to-Board connectors, it ensures seamless signal/power transmission. The gold-plated contact springs and tin-plated copper sleeve guarantee durability. Whether inserted manually or semi-automatically, this component, compliant with RoHS regulations, is a must-have for efficient connectivity in your projects.