5223002-4

Heilind Number:	AMP5223002-4
Manufacturer:	TE Connectivity
Manufacturer Number:	5223002-4
Datasheet:	Datasheet
ECAD Model:

Description:

FB-5R,ASY,120,SIG,HDR,EN,4.25

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Specifications

Attribute	Value
Product Category:	Board To Board PCB Connectors Mezzanine & Board Stacking Connectors
Manufacturer:	TE Connectivity
Manufacturer Part Number:	TE Connectivity 5223002-4
Series:	Z-PACK Future Bus+
Amperage:	3 A
Housing Material:	LCP (Liquid Crystal Polymer)
Number of Rows:	5
Mount Type:	Board Mount
Termination Method:	Through Hole - Press-Fit
Contact Material:	Phosphor Bronze
Contact Plating:	Gold
Overall Width:	18 ;18 mm
Body Orientation:	Straight
Pitch:	.079 in, 2 mm
Voltage:	30 V AC
Contact Type:	Pin
Impedance:	120 Ω
Package Quantity:	12
Contact Amperage:	3 A
Number of Positions:	120
Housing Color:	Natural
Mount Orientation:	Vertical
Insulation Resistance:	5 MΩ
GPL:	473
Packaging:	Tube
Operating Temperature Range:	-67 - 257 °F
Circuit Application:	Signal
Contact Mating Area Plating:	Gold
Contact Mating Area Plating Thickness:	29.921 µin
PCB Retention:	With
PCB Contact Termination Area Plating:	Tin
Connector Height:	17.8 mm, .7 in
PCB Retention Type:	Action/Compliant Tail
Sealable:	No
Mating Alignment:	With
Mating Alignment Type:	Polarization
GPL Description:	Data and Devices
Connector and Contact Terminate To:	Printed Circuit Board
Product Code:	3964
Number of Signal Positions:	120
Contact Layout:	Matrix
Connector System:	Board to Board
Stackable:	No
ECCN:	EAR99
Dielectric Withstanding Voltage:	1000 V AC
Board to Board Configuration:	Vertical
Connector Width:	18 mm, .709 in
PCB Mount Alignment:	Without
Application Solder Feature:	Board Standoff
Termination Post Tail Length:	.167 in, 4.25 mm
Header Type:	Shrouded
Connector Assembly Type:	PCB Mount Header
PCB Contact Termination Area Plating Thickness:	23.622 µin, .6 µm
Contact Mating Area Length:	.256 in, 6.5 mm
Material Flammability Standard:	UL 94V-0
Part Aliases:	5223002-4
SKU:	AMP5223002-4

Detailed Description

Introducing the FB-5R 120-Signal Header, a key component of the Z-PACK Future Bus+ series. Designed for high-speed signal transmission, this assembly features 120 signal positions in a straight body orientation with a 2mm pitch for optimal performance. With a voltage rating of 30V AC and impedance of 120Ω, it ensures reliable connectivity in demanding applications. The housing, made of LCP (Liquid Crystal Polymer), meets UL 94V-0 flammability standards for enhanced safety. Gold-plated phosphor bronze contacts provide excellent conductivity, with a contact amperage of 3A. Suitable for board mount installation, the header offers through-hole press-fit termination and is RoHS compliant. Perfect for signal circuit applications, it guarantees efficient data transmission with a mating alignment feature for easy connection.