| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5223007-4 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 5 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Socket |
| Impedance: | 120 Ω |
| Package Quantity: | 12 |
| Contact Amperage: | 3 A |
| Number of Positions: | 120 |
| Housing Color: | Natural |
| Mount Orientation: | Right Angle |
| Insulation Resistance: | 5 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Power & Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin, .76 µm |
| PCB Retention: | Without |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | 1.3 mm, .76 in |
| Connector Height: | 13.3 mm, .523 in |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 3963 |
| Number of Signal Positions: | 120 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 1000 V AC |
| Board to Board Configuration: | Right Angle |
| Contact Mating Area Plating Finish: | Matte |
| Contact Shape: | Dual Beam |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Locating Posts |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .139 in, 3.53 mm |
| Connector Assembly Type: | PCB Mount Receptacle |
| PCB Contact Termination Area Plating Thickness: | 150 µin, 3.81 µm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5223007-4 |
| SKU: | AMP5223007-4 |
5223007-4
Specifications
Detailed Description
Enhance your power and signal connectivity with the FB-5R Board Mount Receptacle from our Z-PACK Future Bus+ series. With a robust housing made of LCP (Liquid Crystal Polymer) in a natural color and five rows of 120 dual-beam contacts, this connector ensures reliable performance in high-speed data and device applications. Featuring through-hole solder termination, gold plating for optimal contact mating, and a 120Ω impedance, it meets stringent industry standards for quality and durability. Operating in a wide temperature range from -67 to 257°F, it is suitable for demanding environments. The right-angle mount orientation with polarization ensures secure mating alignment, while the compact design with a connector height of 13.3mm allows for space-efficient PCB layout. With UL 94V-0 material flammability standard compliance and RoHS certification, it guarantees safety and environmental responsibility. Perfect for board-to-board configurations, this connector is ideal for various electronic systems requiring efficient data transmission.
Availability
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Stock Location:
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Unit Of Measure:
Each
Minimum/Multiple:
1/1
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Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |