| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5223008-2 |
| Series: | Z-PACK Future Bus+ |
| Amperage: | 3 A |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 5 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Body Orientation: | Right Angle |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Socket |
| Impedance: | 60 Ω |
| Package Quantity: | 24 |
| Contact Amperage: | 3 A |
| Number of Positions: | 60 |
| Housing Color: | Natural |
| Mount Orientation: | Right Angle |
| Insulation Resistance: | 5 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 29.921 µin, .76 µm |
| PCB Retention: | Without |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | 1.3 mm, .76 in |
| Connector Height: | 13.3 mm, .523 in |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 3963 |
| Number of Signal Positions: | 60 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 1000 V AC |
| Board to Board Configuration: | Right Angle |
| Contact Mating Area Plating Finish: | Matte |
| Contact Shape: | Dual Beam |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Locating Posts |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .14 in, 3.55 mm |
| Connector Assembly Type: | PCB Mount Receptacle |
| PCB Contact Termination Area Plating Thickness: | 23.622 µin, .6 µm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | PER-5223008-2,CZ0343-000 5223008-2 |
| SKU: | AMP5223008-2 |
5223008-2
Specifications
Detailed Description
Enhance your signal connectivity with the FB-5R,ASY,060,SIG,REC,EN,3.55 Z-PACK Future Bus+ connector. Featuring a 60-position matrix layout, this board-to-board receptacle is designed for high-speed data transmission at 60 Ω impedance. With a right-angle orientation and through-hole press-fit termination, it ensures secure installation on your PCB. The housing, made of UL 94V-0 rated LCP, guarantees durability and safety. Gold-plated contacts and a contact amperage of 3 A provide reliable power and signal transfer. Operating in a wide temperature range from -67 to 257 °F, it is suitable for various environments. With RoHS compliance and ECCN classification as EAR99, this connector meets international standards for quality and environmental responsibility. Perfect for applications requiring signal integrity and high-speed performance, it is an essential component in modern electronics manufacturing.
For Use With
| Product | Part # | Description | Stock |
|---|---|---|---|
| TE Connectivity 5223002-2 | ![]() |


