| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5223008-6 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 5 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Socket |
| Impedance: | 180 Ω |
| Package Quantity: | 8 |
| Contact Amperage: | 3 A |
| Number of Positions: | 180 |
| Housing Color: | Natural |
| Mount Orientation: | Right Angle |
| Insulation Resistance: | 5 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 29.921 µin, .76 µm |
| PCB Retention: | Without |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | 1.3 mm, .76 in |
| Connector Height: | 13.3 mm, .523 in |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 3963 |
| Number of Signal Positions: | 180 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 1000 V AC |
| Board to Board Configuration: | Right Angle |
| Contact Mating Area Plating Finish: | Matte |
| Contact Shape: | Dual Beam |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Locating Posts |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .14 in, 3.55 mm |
| Connector Assembly Type: | PCB Mount Receptacle |
| PCB Contact Termination Area Plating Thickness: | 23.622 µin, .6 µm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5223008-6 |
| SKU: | AMP5223008-6 |
5223008-6
Specifications
Detailed Description
Introducing the FB-5R Future Bus+ board-to-board connector, designed for high-performance signal transmission in electronic systems. With a compact 5-row configuration and 180 signal positions, this connector offers reliable connectivity for demanding applications. Featuring Through Hole - Press-Fit termination and durable LCP housing material, it ensures secure mounting and long-term durability. The gold-plated contact mating area with a thickness of .76 µm guarantees excellent signal integrity, while the 180 Ω impedance and 3 A contact amperage support efficient data transmission. Operating in a wide temperature range from -67 to 257 °F, this connector is suitable for versatile environments. Its UL 94V-0 rated housing and RoHS compliance ensure safety and environmental responsibility. Ideal for use in data and device applications, the FB-5R is a critical component for high-speed signal processing and connectivity.
Availability
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Unit Of Measure:
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Minimum/Multiple:
1/1
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Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |