| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5223008-8 |
| Series: | Z-PACK Future Bus+ |
| Amperage: | 3 A |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 5 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Body Orientation: | Right Angle |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Socket |
| Impedance: | 240 Ω |
| Package Quantity: | 6 |
| Contact Amperage: | 3 A |
| Number of Positions: | 240 |
| Housing Color: | Natural |
| Mount Orientation: | Right Angle |
| Insulation Resistance: | 5 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 29.921 µin |
| PCB Retention: | Without |
| PCB Contact Termination Area Plating: | Tin |
| Connector Height: | 13.3 mm, .523 in |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 3963 |
| Number of Signal Positions: | 240 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 1000 V AC |
| Board to Board Configuration: | Right Angle |
| Contact Mating Area Plating Finish: | Matte |
| Contact Shape: | Dual Beam |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Locating Posts |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .14 in, 3.55 mm |
| Connector Assembly Type: | PCB Mount Receptacle |
| PCB Contact Termination Area Plating Thickness: | 23.622 µin, .6 µm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5223008-8 |
| SKU: | AMP5223008-8 |
5223008-8
Specifications
Detailed Description
Introducing the FB-5R Board Mount Receptacle, a key component in the Z-PACK Future Bus+ series. Designed for high-speed signal transmission, this assembly features 240 signal positions with a 3 A amperage rating. Its right-angle orientation and through-hole press-fit termination method ensure secure and efficient PCB mounting. Constructed with LCP housing and gold-plated phosphor bronze contacts, it guarantees reliable performance in demanding environments. With a 2 mm pitch and 240 Ω impedance, this connector is ideal for applications requiring precision and signal integrity. UL 94V-0 compliant and RoHS certified, it meets stringent quality and environmental standards. Suitable for a wide range of circuit applications, the FB-5R is a versatile solution for board-to-board connectivity.

