| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5223093-1 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 5 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Socket |
| USOC Codes: | Futurebus+ |
| Row Spacing: | .079 in, 2 mm |
| Package Quantity: | 48 |
| Contact Amperage: | 5 A |
| Number of Positions: | 10 |
| Housing Color: | Natural |
| Mount Orientation: | Right Angle |
| GPL: | A87 |
| Packaging: | Tube |
| Operating Temperature Range: | -55 - 125 °C, -67 - 257 °F |
| Circuit Application: | Power |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 29.92 µin, .76 µm |
| PCB Retention: | With |
| Contact Termination Plating Thickness: | 149 µin, 3.81 µm |
| Contact Underplating Material: | Palladium Nickel |
| Connector Height: | 13.3 mm, .523 in |
| PCB Retention Type: | Solder Leads |
| Sealable: | No |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 4271 |
| Number of Power Positions: | 10 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Contact Termination Plating: | Tin |
| Connector Product Type: | Connector Assembly |
| Mating Post Length: | .226 in, 5.75 mm |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 1000 V AC |
| PCB Mount Alignment Type: | Locating Posts |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .139 in, 3.53 mm |
| Contact Retention: | Without |
| Glow Wire Rating: | Standard Part - Not Glow Wire |
| Connector and Housing Type: | Receptacle |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5223093-1 |
| SKU: | AMP5223093-1 |
5223093-1
Specifications
Detailed Description
Introducing the Z-PACK Future Bus+ Connector, a high-performance solution for power applications. Featuring a durable LCP (Liquid Crystal Polymer) housing in a natural color, this connector is designed for reliable board-to-board mounting with right-angle orientation. With five rows and ten positions, it offers efficient power transmission with a contact amperage of 5A and a voltage rating of 30V AC. The through-hole solder termination method and phosphor bronze contacts ensure secure and stable connections, while the gold plating in the mating area enhances conductivity. Operating in a wide temperature range from -55 to 125°C, this connector is suitable for various environments. With UL 94V-0 flammability standard compliance and RoHS certification, it meets stringent safety and environmental regulations. Ideal for power applications, the Z-PACK Future Bus+ offers exceptional performance and durability in a compact and efficient design.
Availability
In Stock:
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Stock Location:
In Stock
Factory Stock:
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Factory Lead:
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Unit Of Measure:
Each
Minimum/Multiple:
1/1
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Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |