| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5223116-1 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 5 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Pin |
| Package Quantity: | 6 |
| Contact Amperage: | 3 A |
| Number of Positions: | 210 |
| Housing Color: | Natural |
| Insulation Resistance: | 5 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 29.921 µin, .76 µm |
| PCB Retention: | With |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | .76 in |
| Connector Height: | 17 mm, .668 in |
| PCB Retention Type: | Action/Compliant Tail |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 3964 |
| Number of Signal Positions: | 210 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 1000 V AC |
| Board to Board Configuration: | Vertical |
| Contact Mating Area Plating Finish: | Matte |
| Connector Width: | 18 mm, .709 in |
| PCB Mount Alignment: | Without |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .167 in, 4.25 mm |
| Connector Assembly Type: | PCB Mount Header |
| Contact Mating Area Length: | .226 in, 5.75 mm |
| Mating / Unmating Configuration: | Sequencing |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5223116-1 |
| SKU: | AMP5223116-1 |
5223116-1
| Heilind Number: | AMP5223116-1 |
| Manufacturer: | TE Connectivity |
| Manufacturer Number: | 5223116-1 |
| Datasheet: | Product Specification |
| ECAD Model: |
Specifications
Detailed Description
Introducing the FB-5R,ASY,210,SIG,HDR,SL,SEQ, a high-performance Z-PACK Future Bus+ connector designed for board-to-board applications. With five rows and a total of 210 signal positions, this connector offers seamless signal transmission with a pitch of 2mm (.079in). It features Through Hole - Press-Fit termination for secure mounting on the PCB, ensuring reliability in demanding environments. The housing, made of LCP (Liquid Crystal Polymer) in a natural color, meets UL 94V-0 flammability standards. With gold plating in the contact mating area, it guarantees optimal conductivity. Operating at temperatures ranging from -67 to 257°F, this connector is suitable for a wide range of signal circuit applications. Its vertical board-to-board configuration and polarization mating alignment ensure easy and accurate connections. With a compact connector width of .709in (18mm) and a low profile of .668in (17mm), it is ideal for space-constrained designs. RoHS compliant and offering an insulation resistance of 5 MΩ, this connector is both environmentally friendly and high-performing. Whether for data transmission or device connectivity, the FB-5R,ASY,210,SIG,HDR,SL,SEQ connector is the perfect solution for your PCB interconnection needs.

