| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5223513-2 |
| Series: | Z-PACK Future Bus+ |
| Amperage: | 3 A |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 4 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold Over Palladium-Nickel |
| Overall Width: | 16 ;16 mm |
| Body Orientation: | Right Angle |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Pin |
| Impedance: | 48 Ω |
| Package Quantity: | 24 |
| Contact Amperage: | 3 A |
| Number of Positions: | 48 |
| Housing Color: | Natural |
| Mount Orientation: | Right Angle |
| Insulation Resistance: | 4 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .08 µm, 3.1496 µin |
| PCB Retention: | With |
| Contact Underplating Material: | Nickel |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | .08 in, 1.3 mm |
| Connector Height: | 11.2 mm, .44 in |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 2370 |
| Number of Signal Positions: | 48 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 1000 V AC |
| Board to Board Configuration: | Right Angle |
| Contact Mating Area Plating Finish: | Matte |
| Connector Width: | 16 mm, .622 in |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Locating Posts |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .107 in, 2.73 mm |
| Connector Assembly Type: | PCB Mount Header |
| PCB Contact Termination Area Plating Thickness: | 150 µin, 3.81 µm |
| Contact Mating Area Length: | .197 in, 5 mm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5223513-2 |
| SKU: | AMP5223513-2 |
5223513-2
Specifications
Detailed Description
Experience seamless connectivity with our Z-PACK Future Bus+ series Board to Board PCB Connector. Engineered for optimal performance, this connector features a 4-row design with 48 positions, offering reliable signal transmission in various applications. With a right-angle mount orientation and through-hole solder termination method, it ensures secure attachment to your PCB. The housing, made of high-quality LCP, guarantees durability, while the gold-plated contacts provide excellent conductivity. Meeting UL 94V-0 flammability standards and RoHS compliance, this connector prioritizes safety and environmental responsibility. Perfect for data and device connectivity, it's a versatile solution for your PCB interconnection needs.

