| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5223524-1 |
| Series: | Z-PACK Future Bus+ |
| Amperage: | 3 A |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 5 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold Over Palladium-Nickel |
| Body Orientation: | Right Angle |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Pin |
| Impedance: | 30 Ω |
| Package Quantity: | 48 |
| Contact Amperage: | 3 A |
| Number of Positions: | 30 |
| Housing Color: | Natural |
| Mount Orientation: | Right Angle |
| Insulation Resistance: | 5 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Power & Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 29.921 µin, .5 µm |
| PCB Retention: | Without |
| Contact Underplating Material: | Nickel |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | 1.3 mm, .5 in |
| Connector Height: | 13.5 mm, .531 in |
| PCB Retention Type: | Action/Compliant Tail |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 2370 |
| Number of Signal Positions: | 30 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 1000 V AC |
| Board to Board Configuration: | Right Angle |
| Contact Mating Area Plating Finish: | Matte |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Locating Posts |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .132 in, 3.35 mm |
| Connector Assembly Type: | PCB Mount Header |
| PCB Contact Termination Area Plating Thickness: | 1.969 µin, .5 µm |
| Contact Mating Area Length: | .226 in, 5.75 mm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5223524-1 |
| SKU: | AMP5223524-1 |
5223524-1
Specifications
Detailed Description
Introducing the Z-PACK Future Bus+ Board-to-Board Connector, a high-performance solution for power and signal transmission in electronic systems. With five rows of 30 signal positions each, this connector offers seamless connectivity in a compact design. Featuring right-angle mount orientation and through-hole press-fit termination, it ensures secure attachment to the PCB. The housing, made of LCP (Liquid Crystal Polymer) in a natural color, meets UL 94V-0 flammability standards for enhanced safety. Gold-plated phosphor bronze contacts with a contact impedance of 30 Ω guarantee reliable signal transmission. Operating in a wide temperature range from -67 to 257 °F, this connector is suitable for diverse applications. Whether you're designing telecommunications equipment, industrial machinery, or consumer electronics, the Z-PACK Future Bus+ Connector delivers performance and durability. With RoHS compliance and ECCN designation of EAR99, it meets international standards for environmental responsibility and export control. Elevate your PCB connectivity with this cutting-edge connector, designed for the future of electronic systems.
For Use With
| Product | Part # | Description | Stock |
|---|---|---|---|
 | TE Connectivity 5223008-1 |  |
Availability
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Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |