5223627-1

Heilind Number:AMP5223627-1
Manufacturer:TE Connectivity
Manufacturer Number:5223627-1
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

FB-5R,ASY,060,SIG,REC,EN,3.55

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5223627-1
Series:Z-PACK Future Bus+
Housing Material:LCP (Liquid Crystal Polymer)
Number of Rows:5
Mount Type:Board Mount
Termination Method:Through Hole - Press-Fit
Contact Material:Phosphor Bronze
Pitch:.079 in, 2 mm
Voltage:30 V AC
Contact Type:Socket
Impedance:60 Ω
Package Quantity:24
Contact Amperage:3 A
Number of Positions:60
Housing Color:Natural
Mount Orientation:Right Angle
Insulation Resistance:5 MΩ
GPL:473
Packaging:Tube
Operating Temperature Range:-67 - 257 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.05 µm, 1.969 µin
PCB Retention:With
Contact Underplating Material:Nickel
PCB Contact Termination Area Plating:Tin
PCB Thickness (Recommended):.05 in, 1.3 mm
Connector Height:13.3 mm, .523 in
PCB Retention Type:Action/Compliant Tail
Sealable:No
Mating Alignment:With
Mating Alignment Type:Polarization
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:3963
Number of Signal Positions:60
Contact Layout:Matrix
Connector System:Board to Board
Stackable:No
ECCN:EAR99
Dielectric Withstanding Voltage:1000 V AC
Board to Board Configuration:Right Angle
Connector Contact Load Condition:Selectively Loaded
Contact Mating Area Plating Finish:Matte
PCB Mount Alignment:With
PCB Mount Alignment Type:Locating Posts
Application Solder Feature:Board Standoff
Termination Post Tail Length:.132 in, 3.35 mm
Connector Assembly Type:PCB Mount Receptacle
PCB Contact Termination Area Plating Thickness:.06 µm, 2.362 µin
Material Flammability Standard:UL 94V-0
Part Aliases:5223627-1
SKU:AMP5223627-1

Detailed Description

Experience seamless signal transmission with our FB-5R,ASY,060,SIG,REC,EN,3.55 Board Mount Connector. Part of the Z-PACK Future Bus+ series, this connector features 60 signal positions with a matrix contact layout, perfect for high-speed data and device applications. With a pitch of 2 mm and impedance of 60 Ω, it ensures reliable connectivity. The housing, made of UL 94V-0 rated LCP, offers durability, while the gold-plated contact mating area guarantees efficient performance. Operating in a wide temperature range of -67 to 257 °F, this connector is suitable for various environments. Its through-hole press-fit termination method and right-angle mount orientation facilitate easy installation on PCBs. Trust in its compliance with RoHS standards for environmentally conscious solutions. Whether for board-to-board or mezzanine applications, this connector is the ideal choice for your connectivity needs.