5223650-2

Heilind Number:AMP5223650-2
Manufacturer:TE Connectivity
Manufacturer Number:5223650-2
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

2MM FB,4RV,REC,ASY,048,PF,4.25

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5223650-2
Series:Z-PACK Future Bus+
Amperage:3 A
Housing Material:LCP (Liquid Crystal Polymer)
Number of Rows:4
Mount Type:Board Mount
Termination Method:Through Hole - Press-Fit
Contact Material:Phosphor Bronze
Contact Plating:Gold Over Palladium-Nickel
Body Orientation:Straight
Pitch:.079 in, 2 mm
Voltage:30 V AC
Contact Type:Socket
Impedance:48 Ω
Package Quantity:21
Contact Amperage:3 A
Number of Positions:48
Housing Color:Natural
Mount Orientation:Vertical
Insulation Resistance:4 MΩ
GPL:473
Packaging:Tube
Operating Temperature Range:-67 - 257 °F
Circuit Application:Power & Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin, .76 µm
PCB Retention:With
Contact Underplating Material:Nickel
PCB Contact Termination Area Plating:Tin
PCB Thickness (Recommended):2.4 mm, .76 in
Connector Height:14.3 mm, .562 in
PCB Retention Type:Action/Compliant Tail
Sealable:No
Mating Alignment:With
Mating Alignment Type:Polarization
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:D021
Number of Signal Positions:48
Contact Layout:Matrix
Connector System:Board to Board
Stackable:No
ECCN:EAR99
Dielectric Withstanding Voltage:1000 V AC
Board to Board Configuration:Vertical
Connector Contact Load Condition:Fully Loaded
PCB Mount Alignment:Without
Termination Post Tail Length:.167 in, 4.25 mm
Connector Assembly Type:PCB Mount Receptacle
PCB Contact Termination Area Plating Thickness:.06 µm, 2.362 µin
Material Flammability Standard:UL 94V-0
Part Aliases:5223650-2
SKU:AMP5223650-2

Detailed Description

Introducing the Z-PACK Future Bus+ series, a cutting-edge solution for high-speed power and signal transmission in electronic systems. With a straight orientation and board mount design, these connectors feature four rows of 48 gold-plated phosphor bronze sockets, ensuring reliable connectivity in demanding applications. The LCP housing, meeting UL 94V-0 flammability standards, provides robust protection, while the press-fit termination method guarantees secure attachment to the PCB. Operating at temperatures ranging from -67 to 257 °F, and with a voltage rating of 30 V AC and impedance of 48 Ω, these connectors are designed to perform under harsh conditions. Suitable for vertical board-to-board configurations, the Z-PACK Future Bus+ series offers exceptional performance and durability in diverse electronic systems.