| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5223652-4 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 5 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Socket |
| Impedance: | 120 Ω |
| Package Quantity: | 10 |
| Contact Amperage: | 3 A |
| Number of Positions: | 120 |
| Housing Color: | Natural |
| Mount Orientation: | Vertical |
| Insulation Resistance: | 5 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 29.921 µin, .76 µm |
| PCB Retention: | Without |
| Contact Underplating Material: | Nickel |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | 2.4 mm, .76 in |
| Connector Height: | 14.3 mm, .562 in |
| PCB Retention Type: | Action/Compliant Tail |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | D021 |
| Number of Signal Positions: | 120 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 1000 V AC |
| Board to Board Configuration: | Vertical |
| Contact Mating Area Plating Finish: | Matte |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Locating Posts |
| Termination Post Tail Length: | .167 in, 4.25 mm |
| Connector Assembly Type: | PCB Mount Receptacle |
| PCB Contact Termination Area Plating Thickness: | 23.622 µin, .6 µm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5223652-4 |
| SKU: | AMP5223652-4 |
5223652-4
Specifications
Detailed Description
Enhance your connectivity with the Z-PACK Future Bus+ Board Mount Socket, a high-performance solution designed for signal transmission in demanding environments. Featuring a durable LCP housing in a natural color, this connector ensures reliable operation with its UL 94V-0 material flammability standard. With 120 phosphor bronze contacts plated in gold for optimal conductivity, it offers a contact amperage of 3A and impedance of 120Ω, making it ideal for signal applications. The Through Hole - Press-Fit termination method and vertical mount orientation provide secure attachment to a 2.4mm thick PCB. Operating in a wide temperature range from -67 to 257°F, this connector is suitable for various electronic systems. RoHS compliant and with 1000V AC dielectric withstanding voltage, it guarantees safety and environmental responsibility. Perfect for PCB assembly, this connector is a crucial component in data and device connectivity, meeting the highest industry standards. With its compact design and efficient performance, the Z-PACK Future Bus+ Socket is the perfect choice for your connectivity needs.

