5225398-3

Heilind Number:AMP5225398-3
Manufacturer:TE Connectivity
Manufacturer Number:5225398-3
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

BNC BJK DUAL CP RG55,223

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5225398-3
Series:CP
Crimp Type:Dual
Contact Plating:Gold
Contact Material:Beryllium Copper
Operating Temperature Range:-65 - 165 °C, -85 - 329 °F
Mount Type:Panel
Number of Positions:1
Gender:Jack
Sealable:Yes
Cable Type:RG 223, RG 55, RG 55A, RG 55B
Panel Mount:Rear Mount
Connector System:Cable to Panel
Connector and Contact Terminate To:Wire and Cable
Termination Method:Crimp
Port Configuration:Single Port
Detent:With
Impedance:50 Ω
Interface:BNC
Seal Type:Gasket
Mating Type:Snap-Fit
Body Material:Brass
RF Connector Type:BNC
Dielectric Material:PTFE
Operating Frequency:4 GHz
Mated Outer Diameter (Approximate):14.529 mm, .572 in
Body Plating Material:Nickel
Wire Termination Style:Crimp
Center Contact Material:Beryllium Copper
Contact Captivation Method:Mechanical
Number of Coaxial Contacts:1
Center Contact Plating Material:Gold
Cable Connector Orientation:Straight
Product Grade:Military
Body Insulation:Without
Coupling Nut Material:Brass
Center Contact Plating Thickness:1080 µin
Body Shape:Circular
Panel Attachment Style:Rear Mount
Part Aliases:5225398-3
SKU:AMP5225398-3

Detailed Description

Enhance your RF connectivity with our BNC BJK DUAL CP RG55,223 panel-mount jack connector. Designed for high-performance applications, this connector features a durable brass body with gold contact plating, ensuring reliable signal transmission at frequencies up to 4 GHz. With a crimp termination method and snap-fit mating type, installation is quick and secure. Its military-grade construction, operating temperature range of -65 to 165 °C, and sealable design make it ideal for demanding environments. Compatible with RG 223, RG 55, RG 55A, and RG 55B cables, it offers versatility for various setups. Trust in its precision engineering for seamless connectivity in data and device applications.