Product Category: | |
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Manufacturer: | TE Connectivity |
Manufacturer Part Number: | 530006-2 |
Termination Method: | Crimp |
Contact Material: | Beryllium Copper |
Package Quantity: | 4500 |
GPL: | 268 |
Packaging: | Strip |
Contact Mating Area Plating: | Tin |
PCB Contact Termination Area Plating: | Tin |
GPL Description: | Industrial |
Lead Free Solder Processes: | Not applicable for solder process capability |
Product Code: | 5123 |
Wire Size: | 22 - 18 AWG, .3 - .9 mm² |
ECCN: | EAR99 |
Accepts Wire Insulation Diameter: | .06 - .09 in, 1.52 - 2.29 mm |
Contact Retention: | With |
Wire Contact Termination Area Plating Material: | Tin-Lead |
Wire Contact Termination Area Plating Thickness: | 150 µin |
Contact Retention Type in Housing: | Locking Lance |
Part Aliases: | 530006-2 |
SKU: | AMP530006-2 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
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03/22/2022 | P-21-021943 - Manufacturing location change. Following Part Numbers will be transferred from the current location of our TE Connectivity Lickdale, Pennsylvania, USA plant to an outside supplier located in the US. | Download |
04/01/2013 | Project Lantern PTP Migration Parts - MNF. location change from NC. | Download |