530720-2

AMP530720-2
Heilind Number:AMP530720-2
Manufacturer:TE Connectivity
Manufacturer Number:530720-2
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

MINI BX-RCPT ASSY 50 POS

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Specifications

AttributeValue
Product Category:
Board To Board PCB Connectors Mezzanine & Board Stacking Connectors
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 530720-2
Housing Material:LCP (Liquid Crystal Polymer)
Number of Rows:2
Termination Method:Through Hole - Solder
Contact Material:Beryllium Copper
Pitch:.05 in, 1.27 mm
Contact Type:Socket
Row Spacing:.15 in, 3.81 mm
Package Quantity:6
Number of Positions:50
Housing Color:Gray
Mount Orientation:Vertical
GPL:090
Packaging:Package
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin
PCB Retention:Without
PCB Contact Termination Area Plating:Tin-Lead
Connector Height:.215 in, 5.46 mm
Sealable:No
Mating Alignment:With
Mating Alignment Type:Polarized
GPL Description:Aerospace Defense & Marine
Connector and Contact Terminate To:Printed Circuit Board
Product Code:5366
Contact Layout:Staggered
Stackable:No
Post Size:.008 x .018 in, .20 x .46 mm
ECCN:EAR99
Application Assembly Feature:None
Termination Post Tail Length:.14 in, .19 in, 3.56 mm, 4.83 mm
Connector Assembly Type:PCB Mount Receptacle
Part Aliases:530720-2
SKU:AMP530720-2

Detailed Description

Easily assemble your PCBs with this Mini BX-RCPT Assembly featuring 50 gold-plated socket contacts for secure connections. The compact design, with a 1.27mm pitch and staggered layout, allows for efficient stacking on printed circuit boards. Made of durable LCP in a sleek gray hue, this vertical mount receptacle is ideal for aerospace, defense, and marine applications. With polarization for precise mating alignment, it ensures reliable performance. The through-hole solder termination method and tin-lead PCB contact plating offer convenience in installation. RoHS non-compliant, this 50-position connector bundle includes six units, perfect for your board-to-board connectivity needs.