| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 530745-2 |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 2 |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Beryllium Copper |
| Contact Plating: | Gold |
| Body Orientation: | Straight |
| Pitch: | .05 in, 1.27 mm |
| Contact Type: | Socket |
| Row Spacing: | .15 in, 3.81 mm |
| Package Quantity: | 6 |
| Number of Positions: | 30 |
| Housing Color: | Gray |
| Mount Orientation: | Vertical |
| GPL: | 090 |
| Packaging: | Package |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 50 µin |
| PCB Retention: | Without |
| PCB Contact Termination Area Plating: | Tin-Lead |
| Connector Height: | .215 in, 5.46 mm |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarized |
| GPL Description: | Aerospace Defense & Marine |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 5327 |
| Contact Layout: | Staggered |
| Stackable: | No |
| Post Size: | .008 x .018 in, .20 x .46 mm |
| ECCN: | EAR99 |
| Application Assembly Feature: | None |
| Termination Post Tail Length: | .14 in, .19 in, 3.56 mm, 4.83 mm |
| Connector Assembly Type: | PCB Mount Receptacle |
| Part Aliases: | 530745-2 |
| SKU: | AMP530745-2 |
530745-2
| Heilind Number: | AMP530745-2 |
| Manufacturer: | TE Connectivity |
| Manufacturer Number: | 530745-2 |
| ECAD Model: | |
Specifications
Detailed Description
Embark on seamless connectivity with this Mini-Box Receptacle Assembly, boasting 30 unsealed positions for versatile PCB mounting. Crafted for Aerospace Defense & Marine applications, its durable Beryllium Copper contacts ensure reliable performance. With Tin-Lead plating and Wave solder compatibility, installation is efficient and secure. The LCP housing in sleek gray houses the connectors, featuring a vertical mount orientation with polarized mating alignment. Staggered contact layout and gold plating on the mating area guarantee optimal signal transmission. Perfect for mezzanine and board stacking setups, this assembly is a must-have for high-performance electronics.
