| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 536513-5 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 4 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Pin |
| Impedance: | 144 Ω |
| Package Quantity: | 8 |
| Contact Amperage: | 5 A |
| Number of Positions: | 144 |
| Housing Color: | Natural |
| Mount Orientation: | Vertical |
| Insulation Resistance: | 4 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 1.27 µm, 50 µin |
| PCB Retention: | Without |
| PCB Contact Termination Area Plating: | Tin-Lead |
| PCB Thickness (Recommended): | 1.27 in, 1.3 mm |
| Connector Height: | 17 mm, .669 in |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 1832 |
| Number of Signal Positions: | 144 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Board to Board Configuration: | Vertical |
| Connector Width: | 16 mm, .622 in |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Locating Posts |
| Application Assembly Feature: | None |
| Termination Post Tail Length: | .167 in, 4.25 mm |
| Connector Assembly Type: | PCB Mount Header |
| PCB Contact Termination Area Plating Thickness: | 150 µin |
| Contact Mating Area Length: | .197 in, 5 mm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 536513-5 |
| Replacement Part: | 5536513-5 |
| SKU: | AMP536513-5 |
536513-5
Specifications
Detailed Description
Introducing the Z-PACK Future Bus+ series, a cutting-edge solution for board-to-board connections. With a housing made of LCP (Liquid Crystal Polymer) in a natural color, this connector features four rows of 144 positions each, offering high-density signal transmission. The through-hole solder termination method ensures secure and reliable connectivity, while the gold-plated phosphor bronze contacts guarantee optimal conductivity. Operating within a wide temperature range of -67 to 257°F, and with a voltage rating of 30V AC and 5A contact amperage, it meets stringent performance requirements. Compliant with UL 94V-0 flammability standards and RoHS regulations, this connector is ideal for various applications in electronics assembly. Its compact design, with a height of 17mm and width of 16mm, allows for efficient PCB mounting. Featuring polarization and locating posts for easy alignment, it facilitates seamless installation. Whether for data transmission or device interconnection, the Z-PACK Future Bus+ is a versatile and reliable choice.
Availability
In Stock:
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Stock Location:
In Stock
Factory Stock:
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Factory Lead:
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Unit Of Measure:
Each
Minimum/Multiple:
1/1
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Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |