| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 536545-1 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 4 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Pin |
| Impedance: | 96 Ω |
| Package Quantity: | 12 |
| Contact Amperage: | 5 A |
| Number of Positions: | 96 |
| Housing Color: | Natural |
| Mount Orientation: | Vertical |
| Insulation Resistance: | 4 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin, .76 µm |
| PCB Retention: | Without |
| PCB Contact Termination Area Plating: | Tin-Lead |
| PCB Thickness (Recommended): | 1.3 mm, .76 in |
| Connector Height: | 17 mm, .669 in |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 1832 |
| Number of Signal Positions: | 96 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Board to Board Configuration: | Vertical |
| Connector Width: | 16 mm, .622 in |
| PCB Mount Alignment: | Without |
| Application Assembly Feature: | None |
| Termination Post Tail Length: | .167 in, 4.25 mm |
| Connector Assembly Type: | PCB Mount Header |
| PCB Contact Termination Area Plating Thickness: | 150 µin |
| Contact Mating Area Length: | .196 in, .226 in, 5.75 mm, 5 mm |
| Mating / Unmating Configuration: | Make First / Break Last, Sequencing |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 536545-1 |
| SKU: | AMP536545-1 |
536545-1
Specifications
Detailed Description
Introducing the Z-PACK Future Bus+ series, a cutting-edge solution for high-speed signal transmission in electronic assemblies. With four rows of 96 gold-plated contacts, this vertical board-to-board connector ensures reliable connectivity for demanding applications. The housing, made of UL 94V-0 rated LCP, offers exceptional durability and flame resistance. Operating in a wide temperature range from -67 to 257°F, it is suitable for various environments. Featuring a 2mm pitch and through-hole solder termination, it guarantees efficient signal transmission. With a voltage rating of 30V AC and an impedance of 96Ω, it meets stringent performance standards. Whether for data or power applications, this connector delivers optimal functionality. Its compact design, with a height of 17mm, makes it ideal for space-constrained installations. RoHS compliant and capable of lead-free solder processes, it aligns with environmental and industry regulations. From telecommunications to industrial equipment, the Z-PACK Future Bus+ is the perfect choice for high-performance connectivity.
Availability
In Stock:
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Stock Location:
In Stock
Factory Stock:
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Factory Lead:
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Unit Of Measure:
Each
Minimum/Multiple:
1/1
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Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |