| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5536501-1 |
| Series: | Z-PACK Future Bus+ |
| Amperage: | 3 A |
| Housing Material: | Matte |
| Number of Rows: | 4 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Overall Width: | 16 ;16 mm |
| Body Orientation: | Straight |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Pin |
| Impedance: | 24 Ω |
| Package Quantity: | 48 |
| Contact Amperage: | 3 A |
| Number of Positions: | 24 |
| Housing Color: | Natural |
| Mount Orientation: | Vertical |
| Insulation Resistance: | 4 MΩ |
| GPL: | 473 |
| Mating Entry Location: | Top |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin |
| PCB Retention: | With |
| PCB Contact Termination Area Plating: | Tin |
| Connector Height: | 17 mm, .669 in |
| PCB Retention Type: | Action/Compliant Tail |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Guide Pins |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 1832 |
| Number of Signal Positions: | 24 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Board to Board Configuration: | Vertical |
| PCB Contact Termination Area Plating Finish: | Matte |
| Connector Width: | 16 mm, .622 in |
| PCB Mount Alignment: | Without |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .167 in, 4.25 mm |
| Header Type: | Shrouded |
| Connector Assembly Type: | PCB Mount Header |
| PCB Contact Termination Area Plating Thickness: | 150 µin, 3.81 µm |
| Contact Mating Area Length: | .256 in, 6.5 mm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5536501-1 |
| SKU: | AMP5536501-1 |
5536501-1
Specifications
Detailed Description
Enhance your PCB connectivity with our Z-PACK Future Bus+ series, featuring a versatile Board Mount connector with Through Hole - Press-Fit termination. This advanced solution offers 24 signal positions in a straight orientation, ideal for high-speed data transmission in demanding environments. With Phosphor Bronze contacts plated in Gold and a housing made of UL 94V-0 rated Matte material, durability and performance are guaranteed. Operating at a wide temperature range from -67 to 257 °F, this connector ensures reliability in any application. Designed for vertical mounting, it boasts a compact form factor with an overall width of 16mm, perfect for space-constrained designs. Explore the possibilities of seamless board-to-board connectivity with our innovative connector, compliant with RoHS regulations for environmental sustainability. Elevate your electronic assemblies with precision-engineered components from our extensive range of PCB connectors.

